标题: Chips-on-Wafer-on-Substrate (CoWoS) [打印本页] 作者: choi 时间: 昨天 11:07 标题: Chips-on-Wafer-on-Substrate (CoWoS) (1) Wayne Chang, Why This Key Chip Technology Is Crucial to the AI Race Between the US and China. CNN, June 7, 2025 https://www.cnn.com/2025/06/07/t ... y-cowos-ai-hnk-intl
("advanced packaging keeps afloat Moore’s Law * * * While there are many types of advanced packaging technologies, CoWoS, short for Chips-on-Wafer-on-Substrate and invented by TSMC, is arguably the best known * * * It was the brainchild of a team of engineers led by Chiang Shang-yi" in 2009)
Note:
(a) ASE Group https://en.wikipedia.org/wiki/ASE_Group
("Advanced Semiconductor Engineering, Inc 日月光半導體製造股份有限公司, previously known as ASE Group 日月光集團"/ table: Founded 1984 + Headquarters Kaohsiung)
(b) "目前的 CoWoS 常被比喻為「披薩結構」，包含 GPU、HBM 記憶體、矽中介層與基板。但未來的版本將使 CoWoS 的中介層成為多功能運算核心，不再只是用於互連，而是具備整合多種 IC 功能的能力。"
(i) Like a Slice of Pizza: TSMC Strikes Gold with New CoWoS Packaging Technology. InvesTaiwan (Taiwan government's website), Sept 30, 2024 https://investtaiwan.nat.gov.tw/ ... search=202410110001
("If its architecture was a slice of Hawaiian pizza, the ham on top would be the 4-nanometer GPU chips, and the pineapple pieces would be High Bandwidth Memory (HBM). The cheese below would be the silicon interposer, which rests atop the dough—the IC substrate")
(ii) Hawaiian pizza https://en.wikipedia.org/wiki/Hawaiian_pizza